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[IEEE 2019 IEEE 10th International Symposium on Power Electronics for Distributed Generation Systems (PEDG) - Xi'an, China (2019.6.3-2019.6.6)] 2019 IEEE 10th International Symposium on Power Electronics for Distributed Generation Systems (PEDG) - Electro-thermal Stress Comparison between Full Pressure and Silver Sintered Package Press Pack IGBT

[IEEE 2019 IEEE 10th International Symposium on Power Electronics for Distributed Generation Systems (PEDG) - Xi'an, China (2019.6.3-2019.6.6)] 2019 IEEE 10th International Symposium on Power Electronics for Distributed Generation Systems (PEDG) - Electro-thermal Stress Comparison between Full Pressure and Silver Sintered Package Press Pack IGBT

Li, Yaosheng; Wang, Peng; Li, Jinyuan; Long, Haiyang; Yao, Ran; Wang, Xiao; Li, Hui
  • 作者Li, Yaosheng; Wang, Peng; Li, Jinyuan; Long, Haiyang; Yao, Ran; Wang, Xiao; Li, Hui
  • 文件大小1934.14KB
  • 发表时间2019
  • DOI10.1109/PEDG.2019.8807496
  • 页码7-12
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