Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics
- 期刊名称Advanced Materials Technologies
- 作者Lin, Rongzan; Li, Yuanlong; Mao, Xinxin; Zhou, Wanting; Liu, Ran
- 印刷ISSN2365-709X
- 电子ISSN2365-709X
- 文件大小1252.62KB
- 发表时间2019-10-18
- DOI10.1002/admt.201900614
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