[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A Single Flexible Coldplate Cools Multiple Devices
- 作者Tian, Shurong; Takken, Todd; Schultz, Mark; Yao, Yuan; Coteus, Paul; Marroquin, Chris; O'Connell, Kevin; Mahaney, Howard Vic; Yuksel, Anil; Ellsworth, Michael
- 文件大小1306.31KB
- 发表时间2019
- DOI10.1109/itherm.2019.8757281
- 页码1313-1320
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