[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics

Phommahaxay, Alain; Beyer, Gerald; Radu, Iuliana; Beyne, Eric; Guerrero, Alice; Prenger, Luke; Yess, Kim; Arnold, Kim; Tussing, Sebastian; Spiess, Walter; Rapps, Thomas; Kennes, Koen; Lutter, Stefan; Podpod, Arnita; Brems, Steven; Slabbekoorn, John; Sleeckx, Erik; Huyghebaert, Cedric; Asselberghs, Inge; Miller, Andy

作者Phommahaxay, Alain; Beyer, Gerald; Radu, Iuliana; Beyne, Eric; Guerrero, Alice; Prenger, Luke; Yess, Kim; Arnold, Kim; Tussing, Sebastian; Spiess, Walter; Rapps, Thomas; Kennes, Koen; Lutter, Stefan; Podpod, Arnita; Brems, Steven; Slabbekoorn, John; Sleeckx, Erik; Huyghebaert, Cedric; Asselberghs, Inge; Miller, Andy
文件大小1091.20KB
发表时间2019
DOI10.23919/IWLPC.2019.8914124
页码1-8

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[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics