Soft Electronics: Hybrid 3D Printing All‐in‐One Heterogenous Rigidity Assemblies for Soft Electronics (Adv. Mater. Technol. 12/2019)

• 期刊名称Advanced Materials Technologies
• 作者Lin, Rongzan; Li, Yuanlong; Mao, Xinxin; Zhou, Wanting; Liu, Ran
• 卷第4卷
• 期第12期
• 印刷ISSN2365-709X
• 电子ISSN2365-709X
• 文件大小1463.56KB
• 发表时间2019-12
• DOI10.1002/admt.201970065