发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Signal Integrity Analysis for Dual-Stripline Design

[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Signal Integrity Analysis for Dual-Stripline Design

Huang, Nick K. H.; Tseng, Bin-Chyi
  • 作者Huang, Nick K. H.; Tseng, Bin-Chyi
  • 文件大小5061.24KB
  • 发表时间2019
  • DOI10.1109/EDAPS47854.2019.9011618
  • 页码1-3
← 返回【学霸图书馆】主页