Investigation of Low-Profile, High-Performance 62-mm SiC Power Module Package

• 期刊名称IEEE Journal of Emerging and Selected Topics in Power Electronics
• 作者Ke, Junji; Huang, Si; Yuan, Zhao; Zhao, Zhibin; Cui, Xiang; Ang, Simon S.; Chen, Zhong
• 印刷ISSN2168-6777
• 电子ISSN2168-6785
• 文件大小6602.13KB
• 发表时间2020
• DOI10.1109/JESTPE.2020.2971623
• 页码1-1