![[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging]()
[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Hybrid Cu particle paste with surface-modified particles for high temperature electronics packagingBhogaraju, Sri Krishna; Mokhtari, Omid; Pascucci, Jacopo; Hanss, Alexander; Schmid, Maximilian; Conti, Fosca; Elger, Gordon · 2019