Highly Integrated Guidewire Ultrasound Imaging System-on-a-Chip

• 期刊名称IEEE Journal of Solid-State Circuits
• 作者Lim, Jaemyung; Tekes, Coskun; Arkan, Evren F.; Rezvanitabar, Ahmad; Degertekin, F. Levent; Ghovanloo, Maysam
• 卷第55卷
• 期第5期
• 印刷ISSN0018-9200
• 电子ISSN1558-173X
• 文件大小8105.64KB
• 发表时间2020-5
• DOI10.1109/JSSC.2020.2967551
• 页码1310-1323