![Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps]()
Experimental and Numerical Verification of Fatigue Life Estimation for Solder BumpsMUKAI, Minoru; TAKAHASHI, Hiroyuki; KAWAKAMI, Takashi; TAKAHASHI, Kuniaki; IWASAKI, Ken; KISHIMOTO, Kikuo; SHIBUYA, Toshikazu · JSME International Journal Series A · 2001