Non-Conventional Route To Glass-Ceramics For Electronic Packaging
- 期刊名称MRS Proceedings
- 作者Gensse, C.; Chowdhry, U.
- 卷第73卷
- 电子ISSN1946-4274
- 文件大小2049.27KB
- 发表时间1986-1
- DOI10.1557/proc-73-693
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