[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Investigation of Interconnect Design on Chip Package Interaction and Mechanical Reliability of Cu/Low-k Multi-Layer Interconnects in Flip Chip PackageUchibori, Chihiro J.; Zhang, Xuefeng; Ho, Paul S.; Nakamura, Tomoji · 2008

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Investigation of Mechanical Reliability of Cu/low-k Multi-layer Interconnects in Flip Chip PackagesUchibori, Chihiro J.; Zhang, Xuefeng; Im, Sehyuk; Ho, Paul S.; Nakamura, Tomoji · 2007