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Structural Variation of Electrodeposited Copper Film with the Addition of an Excess Amount of H[sub 2]SO[sub 4]

Structural Variation of Electrodeposited Copper Film with the Addition of an Excess Amount of H[sub 2]SO[sub 4]

Fukunaka, Y.
  • 期刊名称Journal of The Electrochemical Society
  • 作者Fukunaka, Y.
  • 卷第137卷
  • 期第1期
  • 印刷ISSN0013-4651
  • 文件大小1007.73KB
  • 发表时间1990
  • DOI10.1149/1.2086445
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