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[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Table of contents2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - [Cover]2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - [Front cover]2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm commitees - 2012 [read: committees]2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - This page intentionally left blank2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - New thermoelectric materials and applicationsJovanovic, Velimir; Ghamaty, Saeid; Bass, John C. · 2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Reliability of column/board/CCGA attachmentGhaffarian, Reza · 2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Proceedings of the Thirteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm 2012 [Copyright notice]2012
Coalescence-Induced Jumping of Multiple Condensate Droplets on Hierarchical Superhydrophobic SurfacesChen, Xuemei; Patel, Ravi S.; Weibel, Justin A.; Garimella, Suresh V. · Scientific Reports · 2016
Characterization of liquid film thickness in slug-regime microchannel flowsPatel, Ravi S.; Weibel, Justin A.; Garimella, Suresh V. · International Journal of Heat and Mass Transfer · 2017
Technique for quantitative mapping of three-dimensional liquid–gas phase boundaries in microchannel flowsPatel, Ravi S.; Garimella, Suresh V. · International Journal of Multiphase Flow · 2014
An optical approach for quantitative characterization of slug bubble interface profiles in a two-phase microchannel flowPatel, Ravi S.; Weibel, Justin A.; Garimella, Suresh V. · International Journal of Heat and Mass Transfer · 2015
Mechanistic modeling of the liquid film shape and heat transfer coefficient in annular-regime microchannel flow boilingPatel, Ravi S.; Weibel, Justin A.; Garimella, Suresh V. · International Journal of Heat and Mass Transfer · 2017
[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Diagnostic Technique for Quantitative Resolution of Three-Dimensional Liquid-Gas Phase Boundaries in Microchannel FlowsPatel, Ravi S.; Garimella, Suresh V. · 2013
[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Dependence of Flow Boiling Heat Transfer Coefficient on Location and Vapor Quality in a Microchannel Heat SinkPatel, Ravi S.; Harirchian, Tannaz; Garimella, Suresh V. · 2011