![[ASME ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences - San Francisco, California, USA (July 19–23, 2009)] Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment - Development of a Quantitative Nanoscale Thermal Conductivity Profiling Technique by the Removal of Influence Due to Heat Transfer Through the Air]()
[ASME ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences - San Francisco, California, USA (July 19–23, 2009)] Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment - Development of a Quantitative Nanoscale Thermal Conductivity Profiling Technique by the Removal of Influence Due to Heat Transfer Through the AirKim, Kyeongtae; Chung, Jaehoon; Hwang, Gwangseok; Kwon, Ohmyoung; Lee, Joon Sik; Park, Seungho; Choi, Young Ki · 2009