![[IEEE IEEE 2005 International Interconnect Technology Conference - Burlingame, CA, USA (6-8 June 2005)] Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - Low resistive and highly reliable Cu dual-damascene interconnect technology using self-formed MnSi/sub x/O/sub y/ barrier layer]()
[IEEE IEEE 2005 International Interconnect Technology Conference - Burlingame, CA, USA (6-8 June 2005)] Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - Low resistive and highly reliable Cu dual-damascene interconnect technology using self-formed MnSi/sub x/O/sub y/ barrier layerUsui, T.; Nasu, H.; Koike, J.; Wada, M.; Takahashi, S.; Shimizu, N.; Nishikawa, T.; Yoshimaru, A.; Shibata, H. · 2005