[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging
- 作者Phelan, Patrick E.; Chiriac, Victor; Lee, Tien-Yu Tom
- 文件大小225.27KB
- 发表时间2003
- DOI10.1115/ipack2003-35140
- 页码309-315
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