![[IEEE 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts - Vancouver, British Columbia, Canada (2009.09.14-2009.09.16)] 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts - Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests]()
[IEEE 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts - Vancouver, British Columbia, Canada (2009.09.14-2009.09.16)] 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts - Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay TestsZhou, Yilin; Pecht, Michael · 2009