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Development and reliability of non-conductive adhesive flip-chip packages

Development and reliability of non-conductive adhesive flip-chip packages

L.K. Teh; E. Anto; C.C. Wong; S.G. Mhaisalkar; E.H. Wong; P.S. Teo; Z. Chen

作者L.K. Teh; E. Anto; C.C. Wong; S.G. Mhaisalkar; E.H. Wong; P.S. Teo; Z. Chen
印刷ISSN0040-6090
文件大小1698.67KB
发表时间2004
DOI10.1016/j.tsf.2004.05.077
页码446-453

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