[IEEE 2005 Joint 30th International Conference on Infrared and Millimeter Waves and 13th International Conference on Terahertz Electronics - Williamsburg, VA, USA (2005.09.23-2005.09.23)] 2005 Joint 30th International Conference on Infrared and Millimeter Waves and 13th International Conference on Terahertz Electronics - Copyright page
- 文件大小45.76KB
- 发表时间2005
- DOI10.1109/icimw.2005.1572546
[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Compact electro-thermal model of semiconductor device with nonlinear convection coefficientFeng, L.H.; Rudnyi, E.B.; Korvink, J.G.; Bohm, C.; Hauck, T. · 2005
[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Coupled electro-mechanics simulation methodology of the dynamic pull-in in micro-systemsRochus, V.; Rixen, D.J.; Golinval, J.-C. · 2005