Embedded power: a 3-D MCM integration technology for IPEM packaging application
- 作者Zhenxian Liang; van Wyk, J.D.; Lee, F.C.
- 卷第29卷
- 期第3期
- 印刷ISSN1521-3323
- 电子ISSN1557-9980
- 文件大小4226.18KB
- 发表时间2006
- DOI10.1109/tadvp.2006.879496
- 页码504-512
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