Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable DeviceNAGANO, Kohta; YAGUCHI, Akihiro; TERASAKI, Takeshi; YAMADA, Munehiro · Transactions of the Japan Society of Mechanical Engineers Series A · 2005

Prevention of Railroad Wheel FractureSAKAMOTO, Haruo; HIRAKAWA, Kenji · JSME International Journal Series A · 2003

Finite Deformation Analysis Using Natural StrainKATO, Yasuyuki · JSME International Journal Series A · 2006

Endochronic Simulation for Multiaxial Creep.PAN, Wen-Fung; CHIANG, Wu-Jiunn · JSME International Journal Series A · 1998

Vibration Properties of Structural FRP Composites.MAHERI, M.R.; ADAMS, R.D. · JSME International Journal Series A · 1999

Fatigue Strength Evaluation of Cracked Components.ZHANG, Luoming; AKINIWA, Yoshiaki; TANAKA, Keisuke · JSME International Journal Series A · 1997

Stress Field Caused by Polygonal Inclusion.NOZAKI, Hideaki; HORIBE, Tadashi; TAYA, Minoru · JSME International Journal Series A · 2001

Fabrication of Nickel Based Active CompositesASANUMA, Hiroshi; HAKODA, Genji; MOCHIZUKI, Takeshi · JSME International Journal Series A · 2003

Topology Optimal Compliant MicrogripperHUANG, Shyh-Chour; LEE, Chi-Ming; CHIU, Chien-Ching; CHEN, Wei-Liang · JSME International Journal Series A · 2006