[IEEE 2007 IEEE International Conference on Signal Processing and Communications - Dubai, United Arab Emirates (2007.11.24-2007.11.27)] 2007 IEEE International Conference on Signal Processing and Communications - Covers
- 文件大小396.46KB
- 发表时间2007
- DOI10.1109/ICSPC.2007.4728222
Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSINimura, Masatsugu; Mizuno, Jun; Shoji, Shuichi; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shigetou, Akitsu · IEEE Transactions on Components, Packaging and Manufacturing Technology · 2014
Study on Hybrid Au–Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D IntegrationNimura, Masatsugu; Mizuno, Jun; Shigetou, Akitsu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shoji, Shuichi · IEEE Transactions on Components, Packaging and Manufacturing Technology · 2013
[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Hybrid Au-Au bonding technology using planar adhesive structure for 3D integrationNimura, Masatsugu; Mizuno, Jun; Shigetou, Akitsu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shoji, Shuichi · 2013
[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSINimura, Masatsugu; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shigetou, Akitsu; Shoji, Shuichi; Mizuno, Jun · 2012