![[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Constrained-sintered, low-temperature Co-fired ceramic for IC packaging applications]()
[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Constrained-sintered, low-temperature Co-fired ceramic for IC packaging applicationsNeedes, C.R.; Barker, M.F.; Ollivier, P.T.; Hang, K.W.; Souders, K.E.; Wang, C.B.; Smith, M.A. · 2003