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[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Investigation of Co UBM for direct bumping on Cu/LowK dies

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Investigation of Co UBM for direct bumping on Cu/LowK dies

Labie, R.; Beyne, E.; Ratchev, P.

作者Labie, R.; Beyne, E.; Ratchev, P.
文件大小872.05KB
发表时间2003
DOI10.1109/ectc.2003.1216449
页码1230-1234

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