[IEEE ICC 2011 - 2011 IEEE International Conference on Communications - Kyoto, Japan (2011.06.5-2011.06.9)] 2011 IEEE International Conference on Communications (ICC) - Comparison of the Detrimental Effects of Trapping Sets in LDPC Codes
- 作者Deka, Kuntal; Rajesh, A.; Bora, P. K.
- 文件大小193.96KB
- 发表时间2011
- DOI10.1109/icc.2011.5962724
- 页码1-5
[IEEE 19th International Reliability Physics Symposium - Las Vegas, NV, USA (1981.04.7-1981.04.9)] 19th International Reliability Physics Symposium - Condensation Thermography - A Novel Approach for Locating Short Circuits and Determing Surface Temperatures in Semiconductor DieDerMarderosian, Aaron; Gionet, Vincent; Caccamesi, Vincent · 1981
[IEEE 21st International Reliability Physics Symposium - Phoenix, AZ, USA (1983.04.5-1983.04.7)] 21st International Reliability Physics Symposium - The Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip CarriersDerMarderosian, Aaron; Gionet, Vincent · 1983
[IEEE 20th International Reliability Physics Symposium - San Diego, NV, USa (1982.03.30-1982.04.1)] 20th International Reliability Physics Symposium - A Rapid Technique of Evaluating Thermally Induced Strains in Leadless Ceramic Chip Carriers Mounted to Polymeric SubstratesDerMarderosian, Aaron; Nadeau, Roger; Gionet, Vincent · 1982