[IEEE 2011 4th International Congress on Image and Signal Processing (CISP) - Shanghai, China (2011.10.15-2011.10.17)] 2011 4th International Congress on Image and Signal Processing - Covers
- 文件大小3407.36KB
- 发表时间2011
- DOI10.1109/CISP.2011.6100790
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Wafer level packaging of MEMSEsashi, Masayoshi · Journal of Micromechanics and Microengineering · 2008
Micro electrochemical millingKim, Bo Hyun; Ryu, Shi Hyoung; Choi, Deok Ki; Chu, Chong Nam · Journal of Micromechanics and Microengineering · 2005
Hydrophobicity of curved microstructured surfacesCannon, A H; King, W P · Journal of Micromechanics and Microengineering · 2010
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Dielectrophoretic deflection of ink jetsChiarot, Paul R; Jones, T B · Journal of Micromechanics and Microengineering · 2009
Investigation of a resonance microgeneratorMizuno, Makoto; Chetwynd, Derek G · Journal of Micromechanics and Microengineering · 2003