![[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Solid-state bonding using metallic cone layer for interconnection]()
[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Solid-state bonding using metallic cone layer for interconnectionMing Li, ; Anmin Hu, ; Chen, Zhuo; Qin Lu, ; Zhang, Wenjing; Suga, Tadatomo; Yinghui Wang, ; Higurashi, Eiji; Fujino, Masahisa · 2012