Interfacial Microstructure of Diffusion-Bonded and Annealed Cu-10Fe/Al6061 Clad Material
- 期刊名称Applied Mechanics and Materials
- 作者Jin, Ju Young; Hong, Sun Ig
- 卷第248卷
- 电子ISSN1662-7482
- 文件大小2198.93KB
- 发表时间2012-12
- DOI10.4028/www.scientific.net/amm.248.60
- 页码60-65
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