![[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Analysis of wafer edge pressure distribution using intelligent pad in chemical mechanical polishing]()
[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Analysis of wafer edge pressure distribution using intelligent pad in chemical mechanical polishingLee, Changsuk; Park, Jaehong; Wang, Han; Jeong, Haedo · 2014