[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Effects of Cu orientation and stand-off-height on the microstructure of Cu/SnAgCu interface
- 作者Xiao, Han; Peng, Li; Liang, Jiaxing; Hu, Anmin; Li, Ming
- 文件大小1360.96KB
- 发表时间2014
- DOI10.1109/icept.2014.6922637
- 页码205-208
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