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Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders

Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders

Chen, Xu; Zhou, Jian; Xue, Feng; Bai, Jing; Yao, Yao
  • 期刊名称Journal of Electronic Materials
  • 作者Chen, Xu; Zhou, Jian; Xue, Feng; Bai, Jing; Yao, Yao
  • 卷第44卷
  • 期第2期
  • 印刷ISSN0361-5235
  • 电子ISSN1543-186X
  • 文件大小1892.62KB
  • 发表时间2015-2
  • DOI10.1007/s11664-014-3537-z
  • 页码725-732
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