Thermal Stress Cleaving of Si-Wafer: Investigation of Fracture Initiation during Laser Beam Irradiation
- 期刊名称Advanced Materials Research
- 作者Saman, Alias Mohd; Furumoto, Tatsuaki; Hosokawa, Akira; Ueda, Takashi
- 卷第1101卷
- 电子ISSN1662-8985
- 文件大小962.73KB
- 发表时间2015-4
- DOI10.4028/www.scientific.net/AMR.1101.412
- 页码412-418
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