![[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis]()
[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysisVandevelde, Bart; Zanon, Franco; Griffoni, Alessio; Li, Xiaolong; Willems, Geert; Meneghini, Matteo · 2015