Table of Contents [Table of Contents]
- 期刊名称IEEE Vehicular Technology Magazine
- 卷第11卷
- 期第4期
- 印刷ISSN1556-6072
- 文件大小679.44KB
- 发表时间2016-12
- DOI10.1109/mvt.2016.2613302
- 页码1-2
[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Compact electro-thermal model of semiconductor device with nonlinear convection coefficientFeng, L.H.; Rudnyi, E.B.; Korvink, J.G.; Bohm, C.; Hauck, T. · 2005
[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Coupled electro-mechanics simulation methodology of the dynamic pull-in in micro-systemsRochus, V.; Rixen, D.J.; Golinval, J.-C. · 2005