![[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Comparison of barrier materials and deposition processes for copper integration]()
[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - Comparison of barrier materials and deposition processes for copper integrationMoussavi, M.; Gobil, Y.; Ulmer, L.; Perroud, L.; Motte, P.; Torres, J.; Romagna, F.; Fayolle, M.; Palleau, J.; Plissonier, M. · 1998