![[IEEE Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Windsor, England (8-10 June 1994)] Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Characterisation and reliability evaluation of a verticle multichip module (NCM-TV) technique using test chips]()
[IEEE Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Windsor, England (8-10 June 1994)] Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies - Characterisation and reliability evaluation of a verticle multichip module (NCM-TV) technique using test chipsBarrett, J.; Cahill, C.; Compagno, T.; O'Flaherty, M.; Hayes, T.; Lawton, W.; O'Donavan, J.; McCarthy, G.; Slattery, O.; Waldron, F.; Vera, A.C.; Masgrangeas, M.; Val, C.; Drouhin, I. · 1994