Discussion
- 期刊名称Transactions of the Faraday Society
- 作者Allmand, A. J.; von Halban, ; Burger, H. C.; Ludlam, E. B.; Morton, R. A.; Sidgwick, N. V.; Baly, E. C. C.
- 卷第21卷
- 印刷ISSN0014-7672
- 文件大小113.32KB
- 发表时间1926
- DOI10.1039/tf9262100625
Embedded packaging and assembly; Reliability and supply chain implicationsBauer, Charles E.; Neuhaus, Herbert J. · Microelectronics Reliability · 2013
[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - 3D device integrationBauer, Charles E.; Neuhaus, Herbert J. · 2009
[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - High performance, low pin count packagingBauer, Charles E.; Fillion, Raymond A.; Neuhaus, Herbert J. · 2010
[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Buried parts simplify fine geometry electronic packaging, interconnect, & assemblyBauer, Charles E.; Neuhaus, Herbert J. · 2013
[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Global outlook for embedded device packagingBauer, Charles E.; Neuhaus, Herbert J. · 2010