![SPIE Proceedings [SPIE 3rd International Symposium on Advanced Optical Manufacturing and testing technologies: Optical test and Measurement Technology and Equipment - Chengdu, China (Sunday 8 July 2007)] 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment - Process, reliability test, and interfacial characterization for low temperature wafer direct bonding]()
SPIE Proceedings [SPIE 3rd International Symposium on Advanced Optical Manufacturing and testing technologies: Optical test and Measurement Technology and Equipment - Chengdu, China (Sunday 8 July 2007)] 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment - Process, reliability test, and interfacial characterization for low temperature wafer direct bondingLin, Xiaohui; Pan, Junhua; Wyant, James C.; Shi, Tielin; Tang, Zirong; Wang, Hexin; Liao, Guanglan; Nie, Lei · 2007