Teacher-student relationship
- 期刊名称Psychiatric Bulletin
- 作者Pasmore, J.
- 卷第11卷
- 期第9期
- 印刷ISSN0955-6036
- 文件大小184.51KB
- 发表时间1987-09-01
- DOI10.1192/pb.11.9.317
- 页码317-317
[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Hot Spot Mitigating With Oblique Finned Microchannel Heat SinkLee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang · 2010
[ASME 2010 14th International Heat Transfer Conference - Washington, DC, USA (August 8–13, 2010)] 2010 14th International Heat Transfer Conference, Volume 6 - Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat SinksLee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang · 2010
[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 2 - Enhanced Microchannel Heat Sinks Using Oblique FinsLee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang · 2009
[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Experimental investigation of oblique finned microchannel heat sink<sup>+</sup>Lee, Yong-Jiun; Lee, Poh-Seng; Chou, Siaw-Kiang · 2010
Development of modular productsKusiak, A.; Chun-Che Huang, · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1996
Dynamic manufacturing process controlPearsall, K.; Raines, B. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
Electronic Components ObsolescenceCondra, L.W.; Anissipour, A.A.; Mayfield, D.D.; Pecht, M.G. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Nonvolatile MemoryBrewer, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1997
Semiconductor workbench for integrated modelingWeckman, J. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1994
The benefits of stress testingChan, H.A. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · 1995
Metal diffusion in polymersDas, J.H.; Morris, J.E. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1994
Multiconductor transmission line characterizationWilliams, D.F. · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B · 1997