The effects of microstructure on the mechanical properties of Al2O3-NiAl compositesW.H. Tuan; W.B. Chou; H.C. You; S.T. Chang · 1998

[IRE 1986 International Electron Devices Meeting - ()] 1986 International Electron Devices Meeting - Amorphous Si electronic devices and their applicationsThompson, M.J.; Tuan, H.C. · 1986

Large-area a-Si:H TFT arrays for printing, input scanning and electronic copying applicationsT.C. Chuang; L.E. Fennell; W.B. Jackson; J. Levine; M.J. Thompson; H.C. Tuan; R. Weisfield; T. Hamano; H. Itoh; T. Ozawa; S. Tomiyama · 1987

[IEEE 2008 IEEE International SOI Conference - New Paltz, NY (2008.10.6-2008.10.9)] 2008 IEEE International SOI Conference - PD-SOI MOSFET Body-to-Body leakage scaling trend and optimizationLo, H.C.; Luo, W.C.; Lu, W.Y.; Cheng, C.F.; Wu, Benny; Chen, T.L.; Lien, C.H.; Fung, Samuel K.H.; Tuan, H.C. · 2008

[IEEE International Symposium on VLSI Technology, Systems and Applications - Taipei, Taiwan (17-19 May 1989)] International Symposium on VLSI Technology, Systems and Applications - High temperature alloy and contact annealing with RTA on AlSi/TiW metallizationChou, H.M.; Su, W.-D.; Liou, J.C.; Tuan, H.C. · 1989

[IEEE Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (12-13 June 1989)] Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Enhanced high performance reliable AlSi/TiW metallization for 1.0 mu m CMOS processChou, H.M.; Su, W.D.; Liou, J.C.; Shiue, R.Y.; Tuan, H.C. · 1989

[IEEE Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (12-13 June 1989)] Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference - Enhanced high performance reliable AlSi/TiW metallization for 1.0 mu m CMOS processChou, H.M.; Su, W.D.; Liou, J.C.; Shiue, R.Y.; Tuan, H.C. · 1989