![ECS Transactions [ECS 219th ECS Meeting - Montreal, QC, Canada (May 1 - May 6, 2011)] - Room Temperature Copper Seed Layer Deposition by Plasma-Enhanced Atomic Layer Deposition]()
ECS Transactions [ECS 219th ECS Meeting - Montreal, QC, Canada (May 1 - May 6, 2011)] - Room Temperature Copper Seed Layer Deposition by Plasma-Enhanced Atomic Layer DepositionMao, Jiajun; Eisenbraun, Eric; Omarjee, Vincent; Korolev, Andrey; Dussarrat, Christian · 2011