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Improvement in high-temperature degradation by isotropic conductive adhesives including Ag–Sn alloy fillersM. Yamashita; K. Suganuma · 2006
Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposureM. Yamashita; K. Suganuma · 2002
Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressureM. Yamashita; K. Suganuma · 2006