מבטי המותקפים : אחרי ששים שנה / Soixante Ans Après: les Regards des Agressés || Avant propos
- 期刊名称Revue Européenne des Études Hébraïques
- 期第11期
- 印刷ISSN1280-9640
- 文件大小171.58KB
- 发表时间2005
- DOI10.2307/23492913
[IEEE 2006 Design, Automation and Test in Europe - Munich, Germany (2006.3.6-2006.3.10)] Proceedings of the Design Automation & Test in Europe Conference - Tutorials2006
[IEEE 2006 Design, Automation and Test in Europe - Munich, Germany (2006.3.6-2006.3.10)] Proceedings of the Design Automation & Test in Europe Conference - [Cover]2006
[IEEE 2006 Design, Automation and Test in Europe - Munich, Germany (2006.3.6-2006.3.10)] Proceedings of the Design Automation & Test in Europe Conference - [Cover]2006
[IEEE 2006 Design, Automation and Test in Europe - Munich, Germany (2006.3.6-2006.3.10)] Proceedings of the Design Automation & Test in Europe Conference - Foreword2006
[IEEE 2006 Design, Automation and Test in Europe - Munich, Germany (2006.3.6-2006.3.10)] Proceedings of the Design Automation & Test in Europe Conference - Author index2006
[IEEE 2006 Design, Automation and Test in Europe - Munich, Germany (2006.3.6-2006.3.10)] Proceedings of the Design Automation & Test in Europe Conference - Contributor Listings2006
[IEEE 2006 Design, Automation and Test in Europe - Munich, Germany (2006.3.6-2006.3.10)] Proceedings of the Design Automation & Test in Europe Conference - [Breaker page]2006
[IEEE 2006 Design, Automation and Test in Europe - Munich, Germany (2006.3.6-2006.3.10)] Proceedings of the Design Automation & Test in Europe Conference - Contributor Listings2006
Placement and Routing for 3-D System-On-Package DesignsMinz, J.R.; Eric Wong; Pathak, M.; Sung Kyu Lim · 2006
Multi-objective module placement for 3-D system-on-packageEric Wong, ; Minz, J.; Sung Kyu Lim, · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2006
[IEEE 2007 25th International Conference on Computer Design ICCD 2007 - Lake Tahoe, CA, USA (2007.10.7-2007.10.10)] 2007 25th International Conference on Computer Design - Whitespace redistribution for thermal via insertion in 3D stacked ICsWong, Eric; Lim, Sung Kyu · 2007
[ACM Press the 2006 IEEE/ACM international conference - San Jose, California (2006.11.05-2006.11.09)] Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design - ICCAD '06 - Decoupling capacitor planning and sizing for noise and leakage reductionWong, Eric; Minz, Jacob; Lim, Sung Kyu · 2006
[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Power supply noise-aware 3D floorplanning for system-on-packageEric Wong, ; Minz, J.; Sung Kyu Lim, · 2005