[IEEE Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. - Kyoto, Japan (June 16-18, 2005)] Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. - 2.8Gb/s Inductively Coupled Interconnect for 3-D ICsJian Xu, ; Wilson, J.; Mick, S.; Lei Luo, ; Franzon, P. · 2005

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - AC Coupled Interconnect using Buried Bumps for Laminated Organic PackagesWilson, J.; Lei Luo, ; Jian Xu, ; Mick, S.; Erickson, E.; Hsuan-Jung Su, ; Benson Chan, ; How Lin, ; Franzon, P. · 2006

[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Fully integrated AC coupled interconnect using buried bumpsWilson, J.; Mick, S.; Jian Xu, ; Lei Luo, ; Bonafede, S.; Huffman, A.; LaBennett, R.; Franzon, P. · 2005