![[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Buried parts simplify fine geometry electronic packaging, interconnect, & assembly]()
[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Buried parts simplify fine geometry electronic packaging, interconnect, & assemblyBauer, Charles E.; Neuhaus, Herbert J. · 2013