Investigation on Cu TSV-Induced KOZ in Silicon Chips: Simulations and Experiments

Tsai, Ming-Yi; Huang, Pu-Shan; Huang, Chen-Yu; Jao, Hsiu; Huang, Brady; Wu, Blacksmith; Lin, Yuan-Yuan; Liao, Will; Huang, Joe; Huang, Lawrence; Shih, Steven; Lin, Jeng Ping

期刊名称IEEE Transactions on Electron Devices
作者Tsai, Ming-Yi; Huang, Pu-Shan; Huang, Chen-Yu; Jao, Hsiu; Huang, Brady; Wu, Blacksmith; Lin, Yuan-Yuan; Liao, Will; Huang, Joe; Huang, Lawrence; Shih, Steven; Lin, Jeng Ping
卷第60卷
期第7期
印刷ISSN0018-9383
电子ISSN1557-9646
文件大小1171.49KB
发表时间2013-07
DOI10.1109/TED.2013.2263298
页码2331-2337

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Investigation on Cu TSV-Induced KOZ in Silicon Chips: Simulations and Experiments