海量图书期刊资源,随时随地畅享阅读乐趣
Wideband vertical transitions for multilayer BCB-based MCMXiaoyun Ding; Fei Geng; Le Luo · 2009
Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrateXiaoyun Ding; Fei Geng; Le Luo · 2009
A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabricationFei, Geng; Xiaoyun, Ding; Gaowei, Xu; Le, Luo · Journal of Semiconductors · 2009
Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiPJiajie Tang; Xiaoyun Ding; Fei Geng; Xiaowei Sun; Le Luo · 2012