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[IEEE 2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) - Amsterdam, Netherlands (2014.10.1-2014.10.3)] 2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) - TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip

[IEEE 2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) - Amsterdam, Netherlands (2014.10.1-2014.10.3)] 2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) - TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip

Eghbal, Ashkan; Yaghini, Pooria M.; Yazdi, Siavash S.; Bagherzadeh, Nader
  • 作者Eghbal, Ashkan; Yaghini, Pooria M.; Yazdi, Siavash S.; Bagherzadeh, Nader
  • 文件大小1106.26KB
  • 发表时间2014
  • DOI10.1109/DFT.2014.6962067
  • 页码92-97
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