Collinge et al. reply
- 期刊名称Nature
- 作者Collinge, John; Jaunmuktane, Zane; Mead, Simon; Rudge, Peter; Brandner, Sebastian
- 卷第535卷
- 期第7611期
- 印刷ISSN0028-0836
- 电子ISSN1476-4687
- 文件大小127.16KB
- 发表时间2016-7-13
- DOI10.1038/nature18603
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || PrefaceLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Polyimide HydrolysisLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Subject IndexLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Author IndexLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Conduction Transients in PolyimidesLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Electrophoretic Deposition of PolyimidesLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || Polyimides for Dielectric LayersLupinski, John H.; Moore, Robert S. · 1989
[ACS Symposium Series] Polymeric Materials for Electronics Packaging and Interconnection Volume 407 || New Transfer Molding CompoundsLupinski, John H.; Moore, Robert S. · 1989